Introduction:
Qualcomm is offering internship opportunities for Interim Engineering Interns in both Software (SW) and Hardware (HW) domains. Candidates with a background in Computer Science Engineering, Communication Engineering, or Electronics and Communication Engineering (ECE) are eligible to apply. This internship provides a chance to work on cutting-edge technologies and products in the mobile chipset industry.
Key Information:
Company Website: www.qualcomm.com
Job Role: Interim Engineering Intern SW / HW
Qualification: Masters, Bachelors: Computer Science Engineering, Communication Engineering, ECE,
Batch: Recent Batches
Experience: Freshers
Salary: ₹45,000–₹52,449 per month (Via AmbitionBox)
Job Location: Hyderabad / Bangalore / Chennai / Noida
Last Date: ASAP
Job Summary:
Details About Internship Careers 2023:
Qualcomm is seeking interns for both Software and Hardware engineering roles. The internship offers an opportunity to work on various aspects of Qualcomm’s innovative technologies, including multimedia, wireless modem, platform-level software, IoT, and more.
Interim Engineering Intern SW:
General Summary about Qualcomm Internship:
As a Software Engineering Intern, you will be involved in designing and developing software for Qualcomm’s mobile chipsets. This role encompasses working on multimedia technologies, wireless modem technologies, platform-level software, and IoT technologies. It requires energetic, creative, and self-driven engineers to contribute to Qualcomm’s advancements.
Campus Grads will be working on the following areas:
- Development of real-time embedded software and device drivers
- Mobile software development for Windows Mobile, Android, or Linux
- Platform-level software development for Linux, Android, Windows, Board Support Packages
- IoT technologies for connected cameras, smart assistants, drones, virtual reality, augmented reality, etc.
Skill Opportunities include:
- Software development for embedded platforms
- Multimedia software stack, firmware, and driver development
- Wireless modem and connectivity software and firmware development
- Communication protocol stack software development
- Kernel, BSP, and device driver development
- Application software and UI development
Interim Engineering Intern HW:
General Summary of Qualcomm Internship:
The Hardware Engineering Internship at Qualcomm offers exposure to various areas such as SOC & Hard Macro Physical Design, SOC Validation & Debug, RF & Analog Layout, Digital ASIC Design, and more. It requires inventive minds with diverse skills and backgrounds to contribute to Qualcomm’s innovative projects.
Must have educational background in one or more of the following areas:
- Verifying SoC with embedded RISC/DSP processors, communications/networking ASICs
- RTL design experience and/or strong object-oriented programming knowledge
- Knowledge of wireless/wired communications and protocols or graphics/video multi-media
- Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout in RF/Analog/Mixed Signal IC Design
Frequently Asked Questions (FAQs):
- What educational qualifications are required for the Qualcomm Internship? Candidates with Masters or Bachelors degrees in Computer Science Engineering, Communication Engineering, or ECE are eligible to apply.
- Is prior work experience necessary for the internship? No, this internship is open to freshers.
- What areas will interns work on during the internship? Interns will work on software development, multimedia technologies, wireless modem technologies, IoT, SOC design, and more.
- What is the salary range offered for the internship? The salary ranges from ₹45,000 to ₹52,449 per month, as per AmbitionBox estimates.
- Where are the internship positions located? The internship positions are available in Hyderabad, Bangalore, Chennai, and Noida.
